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Ceramic substrate laser processing technology

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With the development of material technology, ceramic substrates have been used more and more in scientific research applications and industrial applications due to their superior physical and chemical properties. Whether it is precision microelectronics, heavy industry such as aviation ships, or daily necessities for ordinary people, ceramic substrates are found in almost all fields.

However, the ceramic substrate structure is dense and has a certain brittleness. Although the ordinary mechanical method can be processed, there is stress during the processing, especially for some thin ceramic sheets, which are prone to chipping. This makes the processing of ceramic substrates a difficult point for widespread application.

As a flexible processing method, lasers have demonstrated extraordinary capabilities in ceramic substrate processing. Hereinafter, the cutting and drilling of the microelectronic application ceramic circuit substrate will be described in detail as an example.

In the microelectronics industry, traditional processes use PCBs as circuit substrates. However, with the development of the industry, more and more customers demand more stable performance of their microelectronic products, including the stability of mechanical structure, the insulation performance of the circuit and so on. Therefore, ceramic materials have received more and more applications. At present, the mainstream ceramic materials are alumina and aluminum nitride, and the mainstream thickness of the material is less than 2 mm.

In order to achieve more complex circuit design, customers generally require double-sided design circuits, and the upper and lower conduction is formed by injecting silver paste or sputtering metal through the via holes. At the same time, in order to meet the needs of external packaging, the shape of the circuit components also has various changes, including some rounded corners or other anisotropy. For such product designs, the machining method is very difficult. Even if it can be processed, its yield is very low. The widely cited metalworking chemical etching methods or electrical discharge machining methods cannot be applied because of the superior physical and chemical properties of ceramics. In this regard, the laser's contactless processing can greatly improve the feasibility of ceramic laser processing and processing yield.

Samples for 0.635 mm thick alumina and 0.8 mm thick aluminum nitride profiled cuts. It can be seen that not only the cutting edge is smooth and there is no chipping, but the thermal influence of the cutting edge can be effectively controlled. Even if the ceramic is already metallized, accurate cutting can be performed without injuring the metallized part.

Of course, in the 1970s in the world, ceramic laser scriber processing has appeared in the United States. However, it can be seen that today's ceramic substrate cutting technology has been far-reaching.

Traditional CO2 high power lasers are currently the traditional process in ceramic linear cutting applications. Due to its efficient cutting and a substantially flat cutting profile, it is currently the mainstream process for ceramic board processing. However, for some of the more demanding ceramic cutting processes, such as the straight cut of the shape of the circuit unit, it is not applicable. Under the 80x microscope, we can see that the high-power CO2 laser-cut ceramic substrate has irregular bumps on the edge of the stamp, and the undulation range is about 50~90um. How to ensure the high efficiency of laser-cut ceramic substrates, while reducing the edge of similar stamps and improving processing results. Slyton has developed a new solution that, in terms of the company's current processing capabilities, can be used to meet the customer's needs for ceramic half-cut or full-cut processes, and to meet customer requirements for precision, efficiency and processing efficiency.

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