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Do you really know the application of ceramic substrates? Role in semiconductor coolers

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A ceramic substrate refers to a special process plate in which a copper foil is directly bonded to an aluminum oxide (Al2O3) or an aluminum nitride (AlN) ceramic substrate at a high temperature (single or double sided). The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying capacity. ability. Therefore, ceramic substrates have become the foundation material for high-power power electronic circuit construction skills and interconnection skills.
Use of ceramic substrate
◆ High-power power semiconductor module; semiconductor cooler, electronic heater; power control circuit, power mixing circuit.
◆Intelligent power components; high frequency switching power supply, solid state relay.
◆ Car electronics, aerospace and military electronic components.
◆Solar panel components; telecommunications-specific communication machines, receiving systems; industrial electronics such as lasers.
Advantages of ceramic substrates
◆The thermal shrinkage coefficient of the ceramic substrate is close to that of the silicon chip, which can save the transition layer Mo film, save labor, material and reduce the cost;
◆Reduce the welding layer, reduce the thermal resistance, cut the air, and improve the scrap rate;
◆ The line width of 0.3mm thick copper foil under the same current carrying capacity is only 10% of the average printed circuit board;
◆Excellent thermal conductivity makes the chip package very compact, which greatly improves the power density and improves the reliability of the system and device;

◆Ultra-thin (0.25mm) ceramic substrate can replace BeO, no environmental toxicity problem;

ceramic substrates

◆The current carrying capacity is large. The current of 100A passes through the 1mm wide and 0.3mm thick copper body, and the temperature rise is about 17°C. The 100A current is continuously passed through the 2mm wide and 0.3mm thick copper body, and the temperature rise is only about 5°C.
◆The thermal resistance is low, the thermal resistance of the 10×10mm ceramic substrate is 0.63mm, the thermal resistance of the ceramic substrate is 0.31K/W, the thermal resistance of the 0.38mm thick ceramic substrate is 0.19K/W, and the thickness of the 0.25mm ceramic substrate The thermal resistance is 0.14K/W.
◆Insulation withstand high pressure to ensure personal safety and equipment protection.
◆ Can complete new packaging and assembly methods, making the product highly integrated and volume reduction.
Ceramic substrate applied to semiconductor refrigerator
A semiconductor refrigerating sheet, also called a thermoelectric refrigerating sheet, is a product that uses the Peltier effect of a semiconductor material to complete cooling or heating. From the Peltier effect, heat is applied from one end of the component to the other by loading an appropriate DC voltage across the ends of the semiconductor cooler. At this point, the temperature at one end of the chiller will drop and the temperature at the other end will rise. It is worth noting that you can change the direction of the current and change the direction of the warm current to the other end. Therefore, both the cooling and heating functions can be completed together on a thermoelectric cooler.
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