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Do you know the type and characteristics of DPC ceramic substrates?

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DPC ceramic substrate materials are widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules due to their excellent thermal conductivity and stability. On the eve of the reaction to the current industry, it will bring different changes to the global industrial reaction. Assume that as a person in the electronics and electrical profession, if you know the ceramic substrate, you can be a shame! So today, Slyton ceramic circuit board is a small series to give the family a look at the variety and characteristics of ceramic substrates.
First, according to the data
1, Al2O3
Up to now, alumina substrates are the most commonly used substrate materials in the electronics industry. They are related to most other oxide ceramics in terms of mechanical, thermal and electrical functions. They are high in strength and chemical stability, and have a rich source of materials. A wide range of technical manufacturing and different shapes. Now Slyton Alumina Ceramic Substrates have been able to be three-dimensionally customized.
2, BeO
It has a higher thermal conductivity than metal aluminum and is used in places where high thermal conductivity is required, but the temperature rapidly decreases after crossing 300 ° C. The most important thing is that its toxicity is bound to its own opening.
3, AlN
AlN has two very important functions worth paying attention to: one is high thermal conductivity and the other is a shrinkage coefficient that matches Si. The defect is that even if there is a very thin oxide layer on the outside, it will affect the thermal conductivity. As long as the data and process are severely controlled, the AlN substrate with better divergence is produced. Nowadays, AlN consumer technology has a large amount of domestic consumption like Slyton. Compared with Al2O3, AlN price is relatively high, which is also a small bottleneck that restricts its opening. But with the advancement of the economy and the advancement of technology, this bottleneck will eventually disappear.
Based on the above reasons, it can be known that alumina ceramics are used in many aspects because of their superior inductive functions, and they are still in the dominant position in the fields of microelectronics, power electronics, hybrid microelectronics, and power modules.
Second, according to the manufacturing process
At present, there are four kinds of ceramic heat-dissipating substrates, including HTCC, LTCC, DBC and DPC. Among them, LAM belongs to the patented technology of Slyton and Huazhong University of Science and Technology National Photoelectric Laboratory. HTCC\LTCC belongs to the sintering process, and the cost will be higher. .

The DBC and DPC ceramic substrates are the professional technologies that have been developed in China in recent years and are energy-producing. DBC uses high-temperature heating to separate Al2O3 from Cu plates. The technical bottleneck is that it is difficult to handle micro-pores between Al2O3 and Cu plates. The problem that occurred, which made the mass production energy and yield of the product suffer a big battle, while the DPC technology used the direct copper plating technology to deposit Cu on the Al2O3 substrate, and the process was separated from the data and the thin film process technology. Its products are the most widely used ceramic heat sink substrates in recent years. However, its data control and process technology integration can be higher, which makes the technical threshold for entering the DPC industry and stable consumption relatively high.

DPC ceramic substrates

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