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What are the reasons and characteristics of DPC ceramic substrates being adopted?

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The reason why the DPC ceramic substrate is used
Although LED technology has been promoted from time to time, LED light efficiency is getting higher and higher, and the photoelectric conversion power of high-power LED chips can only reach 70% to 80%, which means that 20% to 30% of electrical energy will be converted into heat. The heat energy generated by the LED must be transmitted. At present, the first way is to transfer to the PCB board, but at this time, it will be found that the chip is not stacked with the heat conduction channel and the conductive channel, which is the key to the material selected for the heat conduction channel.
The existing processing plan is to fix the chip directly on the copper heat sink, but the copper heat sink itself is a conductive channel. As far as the light source level is concerned, the same is not completed. The light source is finally packaged on the PCB, and it is still necessary to introduce an insulating layer to complete the thermal power. At this time, the heat is of course not collected on the chip, but it is concentrated near the insulating layer under the light source. Once more power is applied, the heat problem comes out. The DPC ceramic substrate can handle this problem. It can directly fix the chip on the ceramic, and make vertical interconnection holes on the ceramic to form an internal independent conductive channel. The ceramic itself is both an insulator and a heat sink, so that the light source layer is completed. The thermoelectric power is separately. At this time, the lower PCB board does not need to be constructed separately, and it is not required to make an insulating layer on the PCB.
The definition of DPC ceramic substrate and its characteristics

The ceramic substrate to be treated at the source level should have the following characteristics: firstly, it must have high thermal conductivity, its thermal conductivity is several orders of magnitude higher than that of the resin; the second is to have high dielectric strength; the third is High line resolution, so that the chip can be vertically connected with the chip or flipped, and there will be no problem; the fourth is the high surface flatness, the welding time will not be empty; the fifth is that the ceramic and metal should have high Adhesion; the sixth is the vertical interconnection vias, so that the chip package is completed and the circuit is never brought to the front. A substrate that satisfies these conditions requires only a DPC ceramic substrate. Nowadays, many ceramic substrates are made by screen printing. Its process characteristics are not satisfactory for DPC's request, so it can only be called a circuit board, not a semiconductor package substrate.

DPC ceramic substrate

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