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Where is the application of ceramic substrates, and what is the adoption of technology?

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What is a DPC ceramic substrate? It is also called direct copper-plated ceramic substrate. It uses the skills of thin film metallization and electroplating process. It uses the impression transfer method to make metal lines on the ceramic substrate, and then uses the perforation plating technology to form high-density double-sided wiring and straight interconnection. This is its product map, the top is the solid crystal layer, the bottom is the solder layer, the middle is the ceramic, which is provided with straight interconnect holes.
The raw material of DPC ceramic substrate, firstly alumina ceramic, its thermal conductivity is relatively high. If we want to achieve a higher point, we can use aluminum nitride, its thermal conductivity is very high, reaching 170, the thermal conductivity of aluminum alloy is only 220 to 230, which means that it has almost the same thermal conductivity as metal, and its dielectric strength is very high, which is a very good material. Therefore, the higher the power, the better the performance of aluminum nitride ceramics.

DPC ceramic substrate used in three major areas of analysis


ceramic substrate



Traditional lighting: In high-power LED lighting, stage lights, street lights, and landscape lighting have been widely used in the past; in flash, CSP is also used in many places, in addition to the current hot car headlights, LED The light source is also basically a DPC ceramic substrate.
Traditional lighting field
UV LED: Because the UV LED package light source can not contain organic matter, in order to deal with this problem, the traditional method of filling with silica gel can not be satisfied, the market demand a new package structure, that is, the substrate is made into a three-dimensional chamber structure, the chip is placed In the three-dimensional chamber structure, under vacuum or air environment, do not fill the silica gel. The treatment plan introduced by Taiwan is to install an aluminum metal dam on the ceramic base of DPC. The CNC is used to hollow the aluminum plate, open a window, and glue it to the DPC ceramic substrate to meet the package request. However, there are problems such as unreliable glue, heat resistance, and no waterproofing. The treatment scheme introduced by Japan and South Korea is the HTCC ceramic substrate, that is, the high-temperature co-fired ceramic substrate, which is obtained by co-firing the ceramic green film and the tungsten slurry at a high temperature to obtain a ceramic three-dimensional chamber. This scheme has a rough circuit and a large warp deformation. High cost issues.
Cathy has introduced a 3D molded DPC ceramic substrate. First, the bottom line of the product is still selected by the DPC process; the second is that the metal dam and the ceramic substrate are not selected for bonding, and the airtightness after packaging is better; the third is that the process and the current DPC are basically made. The same, in addition to adding a dam; the fourth is that the pattern design is very active, the dam is modular, and the new product development cycle is short.
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