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What is the development background of ceramic substrates?

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With the development of society, the advancement of industry, the advancement of technology, the PCB industry is also getting better and better, and the process functions are becoming more sophisticated. Whether it is a hard board or a soft board, it is still a soft and hard version, or a ceramic substrate with the best heat dissipation function. We are informing us that there is no limit to the limit!
At present, the ceramic substrate is more sophisticated with alumina ceramic circuit board, aluminum nitride ceramic circuit board, many companies can do 3535, 5050, 7070, etc., R&F Tianyi Technology (Wuhan) Co., Ltd. can withstand customer customization, regardless of What standards can be produced, but must meet line spacing greater than 20 microns, but also use fully automated consumption, without excessive manpower, and avoid many process errors.
Such a sunny enterprise that attaches importance to scientific research skills and user experience not only provides corresponding guarantees for employees, but also brings more comprehensive and experienced user experience to customers, about possible copper splashes and bubbles, etc. The craft is also appropriate and sophisticated, the general circuit board professional pleading is not to be able to reach 18-30 MPa, and the withering is due to insufficient strength, our product's separation strength is 45 MPa, that is, the thrust value and the pull value are 45 Megapascal, so it will not fade after welding. The LAM laser activation skill is used. The thickness of the copper coating can be made 0.001-1mm according to the customer's demand. Generally, the copper is 0.03mm, and the error is +/-0.005mm. The copper conduction will not burn out later. This kind of product is mainly used in products with high demand for heat dissipation. Generally, aerospace, car electronics, lighting, and high-power electronic components maximize product functions.
Our laser rapid activation metallization (LAM) technology is in the forefront of the global ceramic PCB industry, which can quickly customize consumption to meet customer needs. The ceramic-based metallized substrate has excellent thermal and electrical functions. It is an excellent material for power LED packaging, violet light, and ultraviolet light. It is especially suitable for package structures such as multi-chip package (MCM) and substrate direct bond chip (COB). Together, it can also be used as a heat-dissipating circuit board for other high-power power semiconductor modules, high-current switches, relays, communication antennas, filters, and solar inverters.

The ceramic PCB professional estimate has a market value of 6 billion US dollars in the smart lighting market, and beats most of the "sunning career" by 7% per year, becoming a new high-tech enterprise in the industry, and in the subway, rail transit, IGBT, new Energy cars and other aspects are used throughout.


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