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The application field of ceramic substrate and what is ceramic substrate

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What is a DPC ceramic substrate? It is also known as direct copper-plated ceramic substrate. It uses the skills of thin film metallization and electroplating process. It uses image transfer method to make metal lines on ceramic substrate, and then uses perforated plating technology to form high-density double-sided wiring and straight interconnection. This is its product map, with a solid crystal layer on top, a solder layer on the bottom, and a ceramic on the center with straight interconnects.
The material of the DPC ceramic substrate is firstly alumina ceramic. Its thermal conductivity is relatively high. Assuming that it is higher, we can use aluminum nitride, its thermal conductivity is very high, reaching 170, the thermal conductivity of aluminum alloy is only 220 to 230, which means that it has almost the same thermal conductivity as metal, and its dielectric strength is very high, which is a very good material. Therefore, the higher the power, the better the performance of aluminum nitride ceramics.
Analysis of DPC ceramic substrate in three fields
Traditional lighting: In high-power LED lighting, stage lights, street lights, and scene lighting have been widely used in the past; in flash, CSP is also widely used, in addition to today's hot car headlights, LED The light source is also basically a DPC ceramic substrate.

UV LED: Because the packaged light source of UV LED can not contain organic matter, in order to cope with this problem, the traditional method of filling with silica gel is not satisfactory. The market demands a new package structure, that is, the substrate is made into a three-dimensional chamber structure, and the chip is placed. In a three-dimensional chamber configuration, under vacuum or air, do not fill the silica gel. The treatment plan introduced by Taiwan is to install an aluminum metal dam on the ceramic base of DPC. The CNC is used to hollow the aluminum plate, open a window, and then glue it to the DPC ceramic substrate, so that the package can be satisfied. However, there is a problem that the glue is unreliable, heat-resistant, and not waterproof. The treatment scheme introduced by Japan and South Korea is the HTCC ceramic substrate, that is, the high-temperature co-fired ceramic substrate, which is obtained by co-firing the ceramic green film and the tungsten slurry at a high temperature to obtain a ceramic three-dimensional chamber. This scheme has a rough circuit and a large warp deformation. High cost questions.


DPC ceramic substrate

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