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Ceramic substrates are the key to automated smart devices

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As a key component of automated smart devices, smart sensors are the foundation and center for intelligent production. It is widely used in various fields of social development, especially in the field of mechanical equipment production. At present, the sensor is moving toward miniaturization, multi-function, intelligence, systemization and networking. We understand that the sensor, such as the car sensor, will be applied to the ceramic circuit board with the promotion of intelligence, so the ceramic circuit board processing has become an important aspect of the development of many pcb circuit board manufacturers.
Ceramic circuit board is the hardware of smart sensor. What is the difference between a general aluminum substrate and a copper substrate?
The aluminum substrate, in the general electrical and thermal conductivity LDE professional use is a double-sided aluminum substrate or a single-sided aluminum substrate, the price is relatively cheap. Generally made of double-sided, although the imported PP is used, but the insulation of the board is also weakened by the use of the thermal conductive rubber. On the thermal conductivity, the aluminum substrate is one tenth of the ceramic circuit board; the copper substrate, even if it is made into electric heating, some LED professional also uses copper substrates, if the orientation of the car sensor is still not acceptable. Car sensors, in high temperature, high corrosive environment, require better thermal conductivity and insulation, and corrosion resistant circuit boards instead.
It is precisely because ceramic circuit boards are different from traditional FR-4 (wave fiber), aluminum substrates and copper substrates. Ceramic materials have good high-frequency performance and electrical properties, and have high thermal conductivity, excellent chemical stability and thermal stability, and are not available in organic substrates. They are ideal packaging for a new generation of large-scale integrated circuits and power electronic modules. material.
1. Higher thermal conductivity
2. More matching thermal contraction coefficient thermal conductivity can be completed 50~190
3. Stronger, lower resistance metal film
Divided into alumina ceramic circuit board and aluminum nitride ceramic substrate
4. The solderability of the substrate is good and the operating temperature is high.
5. Good insulation
6. High frequency loss is small 7. Can stop high density assembly
8. Contains no organic ingredients, is resistant to cosmic rays, has high reliability in aerospace and has long service life.

9. Ceramic substrate, the copper layer does not contain an oxide layer, and can be used for a long time in a restorative atmosphere.



Ceramic substrate

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