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How much do you know about the ceramic substrate manufacturing process?

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  We may know more about the traditional organic resin substrate and the copper-clad process of the metal substrate. The copper-clad process of the ceramic substrate may have only heard of thin films, thick films, etc., but the door inside is still deep. DPC ceramics Xiaobian introduced, in the history of the development of ceramic circuit boards, the ceramic substrate production process has also carried out a variety of.

DPC ceramic


  Since the ceramic substrate does not require an insulating layer, the metallization of the surface is somewhat difficult, and the ceramic substrate manufacturing process is more demanding than the conventional substrate.

  The most advanced is the HTCC skill, which is the high-temperature co-firing skill. At 1600 degrees Celsius, the ceramic powder is sintered with high melting point metals such as tungsten, molybdenum and manganese. The bonding force is almost 3-5KG, but due to tungsten, molybdenum, The conductive function of high melting point metals such as manganese is not very good, and the temperature required for sintering is high, and the cost is expensive. Therefore, in 1982, the company developed a new data skills LTCC, also known as low temperature co-firing skills. Therefore, gold and silver with better conductivity can be selected as electrode data and wiring materials. But the disadvantage is that scale accuracy, product strength, etc. are not easy to control.

  As early as 1975, J.F. Burgess and Y.S. Sun and others proposed a skill. It refers to the special process of copper foil (thickness greater than 0.1mm) under the maintenance of N2 atmosphere, directly bonded to the outer surface of Al2O3 ceramic substrate in the temperature range of 1065 ° C ~ 1083 ° C, also DBC skills. However, DBC uses high temperature heating to combine Al2O3 with Cu plate. The technical bottleneck is that it is difficult to deal with the problem between micro-pores between Al2O3 and Cu plate. Therefore, the mass production capacity and excellent rate of the product will have great problems.

  With the development and research of the skills, the DPC skills appeared behind it, and the film metallization. It is the production of ceramic substrate external metallization lines using vacuum film skills, yellow lithography skills and electrochemical stacking skills. The vacuum film technology enables ultra-low interfacial porosity (<1%) and high adhesion between metal lines and bare ceramic plates, which greatly enhances the product reliability of DPC ceramic substrates; yellow lithography skills make the line width and line spacing of ceramic substrates All can reach the level below 100μm, which is beneficial to get more applications in the trend of miniaturization; electrochemical stacking skills make the copper layer thickness of DPC ceramic substrate easy to control to meet the needs of different power applications; plus high line Flatness, low-scale progressive public service and low-scale public service make DPC ceramic substrates widely used in LED industry, IGBT power modules, automotive electronic carrier boards, refrigeration chip modules, HCPV modules in recent years. , medical electronics and other fields.
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