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Three advantages of high-density pcb plate plating

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  With the ever-increasing demand for wire/distance and pitch, the use of full-plate plating is increasing, especially in the Japanese PCB industry, which is in Japan with precision wires, tiny holes and The development of skills such as ultra-thin board is inseparable. The ceramic substrate is introduced in small series, and now the high-density boards on the market such as HDI buried blind vias, high-layer PCBs, BGA boards, etc. Because the entire board plating skills have the following advantages:

Ceramic substrate

  (1) The entire plate plating layer is more uniform.

  Because of the uneven distribution of the conductive patterns on the surface of the pattern plating, it can be understood from electromagnetic theory or power line dispersion.

  By using the whole plate plating, a uniform copper plating layer can be obtained, so that the thickness of the copper plating layer in the hole and the uniform wire and distance can be obtained uniformly, and then the PCB quality and the pass rate are improved;

  (2) Simplify the process and reduce costs.

  The whole plate plating is performed after the metallization of the holes, followed by electroplating to complete the thickness of the plating in the holes. Then use the masking method or block

  Photolithography and other processes are used to achieve photo-etching resistance, and the desired lines or patterns are formed by exposure, development, and acid etching, without the need for electroplating tin or Sn/Pb alloy resist for alkali etching and Sn/Pb removal. Processes that simplify the process and reduce costs.

  (3) Conducive to the production of precision graphics and improved reliability.

  When using the pattern plating technology to make precision patterns, in the dry film development, because the distance is small, the development and the like are not clean, and the plating layer is easily formed, and the problems such as disconnection and chipping are easily formed during etching. At the same time, the resist must have a certain thickness, otherwise the plating layer will form a "bump" or even form a short circuit. The entire plate can be plated with the thinnest resist to obtain higher quality precision wires and lands.

  In short, the ceramic substrate is described in small series. From the above analysis of various plating methods, the combination of the whole plate plating method and the pulse current plating method is the best choice, especially for the HDI of the micro-via with high aspect ratio. /BUM board.
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