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How much do you know about the heat dissipation principle of ceramic cooling pcb?

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  Ceramic heat dissipation pcb is used in LED heat dissipation, sensor, high power module, etc., mainly for good heat dissipation and insulation performance of ceramic substrate, DPC ceramic small series, then what is the heat dissipation principle of ceramic heat dissipation pcb?

DPC ceramic

  As for the LED, for example, the thermal bottleneck of a system occurs mostly by transferring heat from the LED die to its substrate to the system board. Perhaps the heat dissipation path of this part: one is to directly dissipate heat to the system board through the die substrate. In this heat dissipation path, the heat dissipation capability of the LED die substrate data is a very important parameter; the second is the LED The heat generated will also pass through the electrode metal wires to the system board. In general, the heat dissipation is limited by the slightly elongated shape of the wire itself. Therefore, there has recently been a Eutectic or Flip chip bonding method, which greatly reduces the length of the wire and greatly increases the cross-sectional area of ??the wire, so that the heat dissipation efficiency of the LED electrode wire to the system board is achieved. Will be effectively upgraded.

  Alumina ceramic substrate

  In general, an LED die (Die) is connected to a substrate (Substrate of LED Die) by a gold wire, eutectic or flip chip method to form an LED chip, and then the LED chip is fixed to the system. System circuit board. Thus, the LED may be dissipated directly from the air, or through the LED die substrate to the system board to the atmosphere. The rate of heat dissipation from the system board to the atmosphere depends on the design of the entire luminaire or system.

  Traditional LED cooling method:

  Dissipate heat from the air

  2. Thermal energy is directly derived from the System circuit board

  3. Export thermal energy via gold wire

  4. For eutectic and Flip chip processes, thermal energy will be routed through the vias to the system board.

  The ceramic heat sink pcb. The heat source is derived from the LED die, mainly using the heat sink substrate material itself to have better thermal conductivity. The ceramic substrate is 100 times more heat-dissipating than the aluminum substrate, and the copper substrate is 10 times more heat-dissipating. The ceramic substrate, because of its good thermal conductivity, effectively solves the heat dissipation problem of high-power LED products and promotes the development of the LED industry and products. In addition to its extensive use in the LED industry, ceramic substrates are also widely used in car controllers, sensors and consumer electronics.

  The above is the DPC ceramics small series on the principle of ceramic heat dissipation pcb cooling, the ceramic substrate is really good business is not too much.
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