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Ceramic circuit boards will help the Chinese sensor market

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  Since the birth of the sensor in the 1860s, there have been more than 150 years. Now with the rapid development of the Internet of Things industry, the introduction of ceramic substrates is more and more demanding on sensor technology. The McKinsey report pointed out that by 2025, the economic benefits brought by the Internet of Things will be between 2.7 trillion and 6.2 trillion US dollars. Sensors as an important entry point for IoT sensing layer data collection will inevitably be connected. In the years that followed, there was an explosive increase.

Ceramic substrate

  What is a sensor? The sensor is a detection device consisting of a sensitive component and a conversion component. It can be sensed and can convert the information detected and sensed into electrical signals (voltage, current, frequency or phase, etc.) according to certain rules. The form of output, ultimately the data analysis used by the Internet of Things, artificial intelligence supply data.

  Today, the global sensor mall is dominated by several leading companies in the US, Japan and Germany. There are about 22,000 kinds of sensors in the world. There are about 7,000 types of conventional types and varieties in China, and more than 90% of high-end sensors are still heavily dependent on imports. Digital, intelligent and miniaturized sensors are in short supply.

  At present, the primary skill research direction of domestic sensors is MEMS (Micro-Mechanical Electronics System), which integrates microprocessors and sensors, making it an intelligent data terminal device with environmental awareness, data processing, intelligent control and data communication functions. In microelectronics, the smaller the feature size of an integrated circuit, the higher the integration of the device, the faster the operation and the better the function. The smaller the size of the sensor in the Internet of Things system, the more the system is placed. It is more convenient and more functional. But together, the hardware requirements are even higher, the core of which is the sensor chip. Now there are fewer large-scale sensor manufacturers in China, mainly for small and medium-sized manufacturers. The chip data is mainly based on FR-4 substrate and aluminum substrate. However, in developed countries, ceramic circuit boards have been used on a large scale, ceramic substrates have better stability, better insulation, and ultra-high thermal conductivity has become the jewel of world-class sensor manufacturers.

  There is still a certain distance between domestic sensors and foreign skills, but we can't just look at the skills, we have to upgrade the hardware together, and the hardware is the root. Domestic ceramic circuit boards are also developing very rapidly. The primary skills are film skills, thick film skills, screen printing skills, DPC skills (direct copper skills) and the latest LAM skills (laser fast activation metal skills). LAM is now the most advanced ceramic board processing skill, capable of high-density assembly and line/pitch (L/S) resolution of up to 20μm, making the device short, small, light and thin. It is completely a domestic choice for promoting MEMS.

  Now because the domestic Internet of Things is still in the initial stage, there is no effective communication between many hardware and terminal vendors. The ceramic substrate is introduced in small series, and many manufacturers have no way to guide them out. The terminal manufacturers have not learned to be effective. information. In the case of China's vast land and resources, manufacturers can no longer stick to the rules, must go out, introduce, use higher-end hardware, and drive the technological innovation of the entire industry chain.

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