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What are the properties of cob ceramic substrates?

Word:[Big][Middle][Small] QR Code 2019-9-16     Viewed:    
  Cob ceramic substrates are still used in LED packaging, which can be used to deal with the heat dissipation problem of LED packages. Today, Xiaobian mainly explains the functional advantages of cob ceramic substrates. Function parameters of COB ceramic substrate:

Ceramic substrate

  Constant temperature and humidity: using high-quality packaging materials, it has good weather resistance.

  Thermal shock: The ceramic is Al2O3, the chip substrate is also Al2O3, the thermal expansion coefficient is similar, and the crystal is not welded due to temperature change, resulting in light decay and dead light;

  Thermal resistance effect: very small

  Heat conduction and heat dissipation: high thermal conductivity, large heat conduction area, loose heat, simple heat planning, low heat dissipation cost

  High pressure resistance: 4000V or more

  Luminescence method: surface illumination

  Glare effect: small

  Light fade features: <3%

  UL/GS certification: abbreviated

  Power matching: Due to the high voltage safety, the ceramic COB above 5w is planned to be Vf>24V, which can match the low current and high voltage non-isolated power supply, to reduce the power supply cost, improve the power supply, and improve the reliability of the power supply.

  Light efficiency scale: 100-120lm/w

  Light efficiency improvement: small chip packaging, great room for improvement, the laboratory has achieved 249lm/W

  Cooling cost: the light source has small thermal resistance, short heat path, large heat conduction area, and can be used to reduce the cost of the heat sink.

  Device cost: direct device is fixed to the heat sink, low cost

  Power supply cost: When the certification is required, it can match the non-isolated power supply, and the power supply is high and the cost is low.
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