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High-power semiconductor that is very resistant to heat in aluminum nitride substrates

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  On the market, the two most used ceramic substrates are: alumina ceramic substrates and aluminum nitride ceramic substrates. Both of them are widely used in daily necessities and industrial production due to their mature production process and excellent functions. DPC ceramics is introduced, but the two are very different. Above the thermal conductivity, aluminum nitride ceramics are 7-10 times that of alumina ceramics. Therefore, for high-power semiconductors with high heat dissipation requirements, nitriding Aluminum ceramic substrates are the first choice, and this is also the secret location where they are not afraid of "hot".

DPC ceramic

  High-power semiconductors that are very resistant to heat in aluminum nitride substrates?

  In recent years, the development of semiconductors has been very rapid. According to the calculation of the World Semiconductor Trading Computing Organization (WSTS), the global semiconductor market sales exceeded US$400 billion for the first time in 2018, reaching US$412.221 billion, up 21.6% year-on-year. As a sought-after power semiconductor, VCSEL chips and IGBTs are not to mention. They are widely used in household appliances, rail transit, electrical engineering, renewable energy and smart grids.

  However, both of these requirements for heat dissipation are very high. Due to the IGBT components in today's high-power IGBT modules, trench gate structures are generally used. Compared with the planar gate structure, the trench gate structure generally adopts a processing precision of 1 μm, and the surface area is enlarged under the same volume, and more precision components can be placed to meet the requirements of higher intelligence. However, the density of the components will increase, and the heat during operation is very severe. Therefore, the thermal conductivity is 170-230 W/m.k, and the aluminum nitride ceramic substrate having a thermal expansion coefficient which is more compatible with the silicon chip is the best choice. Not only does it deal with heat dissipation, it also reduces the risk of desoldering.

  As for the VCSEL, the aluminum nitride ceramic substrate is more demanded. Its power density is very high, reaching several hundred watts per square centimeter, or even more than kilowatts. Such a high power density not only causes heat dissipation problems, but also causes stress problems caused by the thermal expansion of the chip and the substrate. Moreover, VCSEL encounters some harsh external environments such as strong acid and alkali in some industrial automation fields, and its chips must be very precise in intelligent automation. Therefore, vacuum packaging is required to prevent the chip from failing due to the external environment. The three-dimensional aluminum nitride ceramic substrate made by Slyton DPC technology can well handle these problems, that is, the substrate is formed into a three-dimensional chamber shape, and the lens is placed above the chip. It not only handles heat and stress problems, but also isolates the damage of external environmental corrosion.

  DPC ceramics Xiaobian introduced, it is because of the aluminum nitride ceramic substrate, those high-power semiconductors can continue to shine in various industries, do not worry about the day when the heat is too high and broken, bringing people more convenient and high-quality experience .
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