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Types and Material of Ceramic Substrate PCB

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Ceramic substrates and ceramic PCBs are popular because of their excellent electrical insulation,high thermal conductivity,excellent solderability and high adhesion strength.There is also a great demand for ceramic substrates in the market.They are mainly used in power electronics,electronic packaging,Hybrid Microelectronics and multi-chip modules.Today,Xiaobian will share the varieties and materials of ceramic substrate pcb.

  Varieties of ceramic substrates:

  At present,there are five popular ceramic heat dissipation substrates:HTCC,LTCC,DBC,DPC and LAM.Among them,LAM belongs to the patent skill of cooperation between Sliton and the National Photoelectric Laboratory of Huazhong University of Science and Technology.HTCCLTCC belongs to sintering process,and its cost will be higher.

  DBC and DPC are professional skills developed and mature in recent years in China.DBC combines aluminium trioxide with copper plate by high temperature heating.The bottleneck of DBC is that it is difficult to solve the problem of micro-pore between aluminium trioxide and copper plate,which makes the production of energy and yield of this product face greater challenges.DPC technology uses direct copper plating technology to deposit copper on Aluminum Trioxide Substrate.Its technology combines material and film technology.Its products are the most widely used ceramic heat dissipation Substrate in recent years.However,the integration ability of material manipulation and process skills is demanded to be high,which makes the skill threshold of stepping into DPC industry and producing steadily relatively high.

  The materials of PCB are usually alumina and aluminium nitride.The alumina ceramic substrate is mainly used in electronic industry because of its high thermal expansion coefficient,while the aluminium nitride material is used in aerospace products with high thermal conductivity and heat dissipation.

Ceramic substrates

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