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Comparison of Ceramic Substrate Used in LED Packaging

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Ceramic substrates and ceramic-based metallized substrates of ceramic circuit boards have outstanding thermal and electrical functions.They are excellent materials for power-type LED packaging,purple light and ultraviolet light.They are especially suitable for multi-chip packaging(MCM)and substrate direct bonding chip(COB)packaging structures.


  1.Comparisons of plastics and ceramics,represented by epoxy resin,have economic characteristics and are widely used in the electronic market.However,with the progress of social progress in many special areas such as high temperature,linear expansion coefficient,air tightness,stability and mechanical functions,plastic materials can not meet the new requirements.Market requirements.Ceramic materials with high resistance,high frequency characteristics,high thermal conductivity,good chemical stability,thermal stability and other advantages,are widely used in different thick films,thin films or circuit substrates,but also can be used as insulators,thermal conduction paths in circuits with strict thermal function requirements,and used to make various electronic elements.Pieces.

  2.Compared with aluminium nitride ceramic substrate,aluminium nitride ceramic substrate has two advantages,one is high thermal conductivity,the other is expansion coefficient matching with silicon.The defect is that the oxide layer will affect the thermal conductivity,and the material and process requirements are higher.At present,China's production skills of large-scale aluminum nitride are not sophisticated,and the price is higher than that of alumina.Alumina ceramic substrates are the most commonly used substrates in the electronic industry.Because they are related to most other oxide ceramics in mechanical,thermal and electrical functions,they have high strength,chemical stability and rich material origin.They are suitable for various skills and different shapes.

  Secondly,the varieties and characteristics of ceramic heat dissipation substrates on the market are mostly divided into HTCC,LTCC,DBC and DPC,while the Sliton brand has the original LAM(Laser Activation Metallization)that is,laser rapid activation metallization skills.

  1.HTCC and LTCCHTCC are attributed to the earlier skills,but because of the high sintering temperature,the choice of electrode materials is limited,and the cost of production is relatively expensive.These factors promote the development of LTCC.Although LTCC lowers the co-firing temperature to about 850 C,it has some defects such as dimension accuracy,product strength and so on,which are difficult to control.

  2.DirectBonded Copper(DBC)skills of DBC and DPC are mainly based on the ceramic surface metallization skills of Al2O3 ceramic substrates,and later used in AlN ceramics.It has been successfully used in the fields of power semiconductor module,solar panel module,car electronics,aerospace and military electronic module,intelligent power module and so on.Thin film deposition(DPC)is the primary method for metal film deposition in microelectronic fabrication.The surface metallization of substrate is carried out by transpiration,magnetron sputtering and other surface deposition processes.First,titanium,chromium and then copper particles are deposited.Finally,the plating is thicker,which is suitable for most ceramic substrates.As a wafer-level fabrication skill,integrated circuit(IC)etching process can easily complete the fabrication of high-precision micro-electronics and even nano-electronic devices,but its fabrication equipment is valuable,high vacuum conditions,long production process,confusing fabrication process and high price,which is not suitable for mass rapid fabrication.

  3.LAM skill is a laser rapid activation metallization skill developed by Sliton Brand.It uses laser to activate both metal and ceramics at the same time,so that they can grow together firmly.LAM skills can make metal lines on alumina,aluminium nitride,zirconia,glass and quartz through laser skills.The surface smoothness of the products is about 0.1um.The thickness of copper cladding can be customized between 1um and 1mm according to customer requirements.The width and diameter of the lines can reach 20um.

  3.The Advantages of Sliton over Traditional Substrate

  1.The higher the thermal conductivity,the better the thermal conductivity is.Traditional metal substrates have good thermal conductivity,but because the conductivity of metal requires insulating layer,the thermal conductivity of insulating layer is only about 1.0W/m.K.,which greatly affects the overall thermal conductivity.Ceramic substrates have high thermal conductivity without using insulating layer.

  2.Better matching coefficient of thermal expansion when the lamp is turned on normally,the temperature is as high as 80~90 C.Unable to withstand the temperature,the welding will not be strong.The general lamp is 0.1w,0.3w,0.5w,about 1w,3w,5w,the lamp,PVC can not bear.The thermal expansion coefficient of ceramics and chips is close to each other,which will not cause too large deformation when the temperature difference changes dramatically,which will lead to the problems of line de-welding,internal stress and so on.

  3.Better bonding ability Traditional DBC,DPC and other skills will produce metal layer shedding and other phenomena.Sliton has self-developed LAM skills.The bonding strength of metal layer and ceramic substrate under laser skills is high,and the maximum can reach 45 MPa(greater than the strength of 1 mm thick ceramic sheet itself).

  4.Traditional DBC skills can only produce 100-600 micron thick conductive layer with arbitrary customization of conductive layer thickness within 1 micron-1 mm.When traditional DBC skills do less than 100 micron,the production temperature will melt too high,and when they do more than 600 micron,the copper layer will be too thick,and the copper will flow down,resulting in ambiguous product margin.DPC skills can reach 300 um in China is very good.Sliton's conductive layer thickness is arbitrarily customized within 1 micron to 1 mm,and the accuracy is very accurate.

  5.The maximum L/S resolution of traditional thick film assembling technology in high density is only 100 microns,and the weldability is poor.The maximum L/S resolution of Al-Mn method is only 100 microns,and the conductivity of Mo and Mn is not good.Sliton can reach 20 microns,and then complete the short,small,light and thin equipment.

  6.Ceramic Substrate,Three-Dimensional Substrate and Three-Dimensional Substrate

Ceramic substrates

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