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The Birth of Ceramic Circuit Board

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DPC ceramics,with the rising awareness of global environmental protection,energy saving and power saving has become an inevitable trend.LED industry is one of the industries with the best development potential this year.LED products have the advantages of energy saving,power saving,high power,fast reaction time,long life cycle,environmental protection and mercury free.

  However,as a potential technical problem caused by the heat dissipation of LED,the severe light decay of LED street lamp severely limits the development of the LED industry.If the heat energy generated by LED illumination can not be exported in time,the temperature of LED junction will be too high,which will affect the production cycle,light-emitting power and stability of the product.The problem of LED street lamp fire decay is affected by temperature.The planning of fins and modules of heat dissipation substrates takes great pains to achieve outstanding heat dissipation effect.However,due to the common terminology of LED street lamp in the field,in order to prevent climate corrosion,the need for paint maintenance has become a hindrance to the heat dissipation link,which still results in poor temperature heat dissipation and light decay.The problem of LED street lamp's light decay causes many devices'LED street lamp in less than a year can't pass the certification inspection of the use unit.

  The research indicates that the input power of general high power LED products is about 20%which can be converted into light,and the remaining 80%of the energy can be converted into heat.Therefore,in order to improve the luminous power of the LED,the heat dispersion management and planning of the LED system has become an important issue.Through the research on the heat dissipation of LED,it is found that in order to deal with the heat dissipation,it is necessary to start with the most basic materials and deal with the heat source of high power LED from inside to outside fundamentally.

  In order to solve the above problems,a ceramic LED circuit board with alumina as the main material and graphite powder and feldspar powder with excellent thermal conductivity was developed,which has good heat dissipation effect,high thermal conductivity,strong oxidation resistance,relatively low operating environment temperature and simple process.The technical scheme is a manufacturing method of ceramic circuit boards,which includes material manufacturing,grinding,mixing,forming and baking.Then the circuit planning is carried out on the ceramic board,and the circuit-bound ceramic circuit boards are prepared on the ceramic board by etching method.The characteristics of the circuit-bound ceramic circuit boards are as follows:the raw materials are manufactured as one component,and the alumina,graphite and feldspar powders are made according to 100.10-1526-30 weight ratio for manufacturing,the second component is tourmaline,containing at least one component of rare elements ore,the weight of which is 4-6%of the total weight of the component;mixing the raw materials prepared above will be placed in the grinder,crushed and grinded into powder,and evenly mixed;before mixing with water,a process of removing magnetic components will be carried out;then forming;monotonously;The forming material is positioned in a cool place and actively monotonous;the baking process places the forming monotonous material in a high temperature furnace and sinters at 1400 1700 C for 50-70 minutes at high temperature under the environment of filling inert gas in the high temperature furnace;after baking,polishing is carried out;after copper cladding is applied to the polished surface of the forming material,the high insulating alumina ceramic substrate is coated with copper metal on one or both sides,and then passes through high temperature 1065.When the copper metal is heated at 1085 C,eutectic melt occurs between copper metal and alumina raw material due to high temperature oxidation,diffusion,and bonding between copper metal and ceramic substrate to form ceramic composite metal substrate.Finally,the etched circuit is made into ceramic circuit board.

  The process of removing magnetic components refers to the use of magnetic objects to move in the powder,completely eliminate the magnetic components in the powder,and demagnetize all raw material powders with magnetic components in the magnetic treatment equipment.The forming means that the stirred material is put into the forming structure to produce a uniform shape.In the baking process,the moisture content in the forming is controlled below 0.2%.After the preparation of ceramic PCB circuit boards,insulating oil is attached to the circuit surface.DPC ceramics.The advantage of the invention is that the method chooses a ceramic PCB circuit board with good thermal conductivity,and adds copper to the ceramic board to sinter into eutectic melt to form a ceramic composite metal substrate.The LED light source is directly encapsulated on the ceramic heat dissipation substrates,and heat dissipated to the ceramic circuit board through the LED grains.The problem of light decay caused by thermal resistance of the high power LED light source in the process of equipment is solved.




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