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What Factors Influence the Leakage Resistance Index of Paper-based Copper Clad Laminates?

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  With the aggravation of environmental pollution and the increase of dust and other pollution in the air,copper clad laminates are affected by dust,moisture condensation or moisture and positive and negative ion pollutants in the working process.Under the action of external electric field,a large leakage current occurs on the surface of copper clad laminates.DPC ceramics,the heat generated by leakage current will steam the surface of the leakage part of the copper clad laminate,forming a part of the drying zone,so that the surface of the copper clad laminate is in an uneven drying condition.Compared with the wet area,the resistance of the dry area is larger,which makes the surface electric field of the whole copper clad laminate become uneven,thus causing flashover discharges.Under the combined action of applied electric field and heat,the appearance of copper clad laminate gradually begins to carbonize.After carbonization,the external resistance decreases and the electric field strength increases,which makes it easier to form flashover discharge.In this vicious cycle,the degree of carbonization of copper clad laminates gradually deepens,thus constituting a carbonization channel,and with the extension of the carbonization channel,the appearance of copper clad laminates eventually loses its insulation.This phenomenon is called leakage mark.

  CTI(Comparative Tracking Index)is the index to measure the resistance of copper clad laminates to electric leakage marking,that is,to compare the electric trace index or relative electric leakage marking index.The bigger CTI value of DPC ceramics,the better the insulation of copper clad laminates and the higher the safety and reliability.



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