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Internal Structure of High Power LED Aluminum Substrate of DPC Ceramics

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  High power LED aluminum substrate is a kind of metal circuit board material,which is composed of copper foil,thermal insulation layer and metal substrate.DPC ceramics introduces its structure in three layers:

  Baselayer bottom layer:it is a metal substrate,generally aluminum or optional copper.Aluminum based copper clad laminates and traditional epoxy glass cloth laminates.

  Cireuitl.layer circuit layer:equivalent to the copper clad plate of ordinary PCB,the thickness of circuit copper foil is from LOZ to 10oz.

  Dielcctriclayer insulating layer:the insulating layer is a layer of low thermal resistance heat conducting insulating material.

  This technology is used in the thermal insulation layer of high-function aluminum substrate,which makes it have excellent thermal conductivity and high-strength electrical insulation function;the metal bottom layer is the support component of aluminum substrate,which requires high thermal conductivity,generally aluminum plate,and copper plate(copper plate can provide better thermal conductivity),which is suitable for drilling,punching,cutting and other conventional machining.PCB material comparison has the advantages that other materials can't compare.SMT technology is installed on the surface of appropriate power components.Without radiator,the volume is greatly reduced,the heat dissipation effect is excellent,and the excellent insulation function and mechanical function.

  The circuit layer(i.e.copper foil)is usually etched to form a printed circuit,so that the components of the components are connected with each other.Generally,the circuit layer requires a large current carrying capacity,so a thick copper foil with a thickness of 35μm~280μm should be used.The thermal insulation layer is the place of aluminum substrate core technology,which is generally composed of a special polymer filled with special ceramics,with small thermal resistance and viscosity.It has excellent function,anti-aging ability,and can accept mechanical and thermal stress.

  For the above DPC ceramic small series about the high-power LED aluminum substrate structure layer,better let us know how its structure principle is,so it is also a good knowledge point for us.

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