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Is Drilling Metallization and Electroplating of DPC Ceramics, High Multilayer Circuit Boards More Complicated?

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  Is drilling metallization and plating of high multilayer circuit boards a little messy?Today DPC ceramics editor shares some common sense in this regard.

  The main components directly assembled on the motherboard or backplane are connectors(connectors).It is very difficult or even impossible to select wave soldering or infrared soldering or hot air soldering.Due to the large and thick area standard of very thick mother board or back plate,the heat capacity required for welding is very large.In this case,if welding is carried out,it will often occur when the molten solder has not filled the plating hole and has been solidified,and then it will block the molten solder from further entering the plating hole,resulting in poor welding points or voids between the connector(connector)pin and the plating hole.Unless higher welding temperature and longer welding time are selected,but in this way,the reliability of electrical connection of motherboard or backplane will be threatened(mainly,Z-direction thermal expansion will cause hole joint fracture,while x-direction and Y-direction thermal expansion,especially over TG temperature will cause deformation,distortion,etc.).Therefore,most of the connectors(connectors)assembled on the motherboard or backplane adopt the method of pressing and inserting technology,that is to say,the pins(pins)on the home connector(connector)are pressed into the plating holes of the motherboard or backplane through pressure,so there is no solder in these plating holes,as long as the copper layer is plated.

  In order to achieve reliable electrical connection,the pins(pins)of these connectors are planned into special geometry.Most of them are polygonal(such as square,regular hexagon,etc.)structures with sharp edges.Under the pressure of pressure,these sharp edges will penetrate into the copper plating layer of the hole wall to form a robust electrical connection.

  In order to meet the plug-in requirements of reliability,DPC ceramic knits found that there are requirements and regulations on the drilling diameter,copper coating thickness or final hole diameter standard of high multilayer circuit board,that is,motherboard or backplane inner plating hole,and even strict regulations on the thickness and final hole diameter standard of inner coating layer,which is higher than the conventional PCB.

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