Today is 2019-12-06 Friday,Welcome to this site 


Company News

What is The Professional PCB Multilayer Board Technology?

Word:[Big][Middle][Small] Mobile page qrcode 2019-11-27     Viewed:    
  The process flow of Multilayer PCB is messy and hard to understand?I don't know where to supplement my professional knowledge?Today's small edition of ceramic substrate will share with us the following knowledge:

  I.purpose of blackening and browning of high multilayer circuit boards

  ①remove oil,impurities and other pollutants on the surface;

  Secondly,increasing the specific surface of the copper foil,so as to increase the touch area with the resin,is conducive to the full dispersion of the resin,forming a larger binding force;

  Thirdly,the non-polar copper surface is changed into the surface with polar CuO and Cu2O,and the polar bond between copper foil and resin is added;

  ④the oxidized surface is not affected by moisture at high temperature,which reduces the possibility of delamination between copper foil and resin.

  ⑤the boards made by the inner line must be laminated by the ability after blackening or browning.It is to oxidize the copper surface of the inner circuit board.Generally,Cu2O is red and CuO is black,so the main Cu2O in the oxide layer is called browning and CuO is called blackening.

  1.Lamination is a process in which the lines of each layer are bonded into a whole by means of b-step semi curing sheet.This kind of bonding is realized by the mutual dispersion and penetration of macromolecules on the interface,so as to interweave with each other.The step-by-step semi-cured sheet is used to bond the lines of each layer into a whole process.This kind of bonding is realized by the mutual dispersion and penetration of macromolecules on the interface,so as to interweave with each other.




ceramic substrate



  2.Purpose:to press the discrete multilayer board together with the bonding sheet into the multilayer board with the required layer number and thickness.

  ①typesetting:the data of copper foil,bonding sheet(semi curing sheet),inner layer plate,stainless steel,barrier plate,kraft paper,outer layer steel plate,etc.shall be laminated according to the process requirements.If the board with more than six layers needs to be pre typeset.The copper foil,bonding sheet(semi curing sheet),inner layer plate,stainless steel,barrier plate,kraft paper,outer layer steel plate and other data are laminated according to the process requirements.If the board with more than six layers needs to be pre typeset.

  ②during the lamination process,the laminated circuit board is fed into the vacuum hot press.The heat energy supplied by the machine is used to melt the resin in the resin sheet,so as to bond the substrate and fill the empty space.

  ③for the designers,the first consideration of lamination is symmetry.Because the plate will be affected by pressure and temperature in the process of lamination,there will be stress in the plate after lamination.Therefore,if the two sides of the laminated board are not uniform,the stress on the two sides is not the same,forming the board zigzag to one side,greatly affecting the performance of PCB.Keyou circuit specializes in the production of high-precision multilayer circuit boards.Its products are widely used in LCD module,communication equipment,instruments and meters,industrial power supply,digital,medical electronics,industrial control equipment,LED module/module,power energy,transportation,research and development of science and education,cars,aerospace and other high-tech fields

  In addition,even in the same plane,if the distribution of copper is not uniform,the resin flow speed at each point will be different,so that the local thickness of copper less cloth will be slightly thinner,and the local thickness of copper more cloth will be slightly thicker.In order to prevent these problems,the factors of uniformity of copper distribution,symmetry of lamination,design and layout of blind hole and so on must be examined in detail.

  II.Drilling and copper sinking

  Objective:to metallize the perforation.

  ①the base material of the circuit board is composed of copper foil,glass fiber and epoxy resin.In the manufacturing process,the hole wall section after the base material drilling is composed of the above three parts of data.

  ②hole metallization is to cover a layer of uniform,heat-resistant and impact resistant copper on the section.The hole metallization is to cover the section with a uniform,heat-resistant and impact resistant layer of copper.

  ③the process is divided into three parts:the first is to drill waste,the second is to sink copper chemically,and the third is to thicken copper(full plate plating copper).

  III.copper sinking and thickening

  The metallization of holes involves a concept of capability,thickness diameter ratio.The thickness diameter ratio is the ratio of plate thickness to aperture.,thickness diameter ratio.The thickness diameter ratio is the ratio of plate thickness to aperture.When the plate becomes thicker and the hole diameter decreases continuously,the chemical Yao water is more and more difficult to enter the deep hole.Although the electroplating equipment uses vibration,pressurization and other methods to let the Yao water enter the center of the hole,the center coating formed by the concentration difference is still too thin to prevent.At this time,there will be micro open circuit phenomenon in the drilling layer.When the voltage increases and the board is impacted under various adverse conditions,the defects will be completely exposed,forming the circuit open circuit of the board,and the designated operation cannot be completed.

  Therefore,designers need to know the process capability of the manufacturer in time,otherwise the PCB designed will be difficult to realize in production.It should be noted that the thickness diameter ratio should be considered not only in through hole design,but also in blind hole design.

  IV.outer dry film and pattern electroplating

  The principle of outer layer pattern transfer is similar to that of inner layer pattern transfer,which uses photosensitive dry film and photographic method to print circuit pattern on board.The difference between the outer dry film and the inner dry film is that if the subtraction method is used,the outer dry film is the same as the inner dry film,and the negative film is used as the plate.The cured dry film part of the board is the circuit.Remove the uncured film and etch the back film through acid etching.The circuit pattern is left on the board because it is protected by the film.

  Well,the above is the process flow of PCB multi-layer board shared by ceramic substrate editor.I hope it can help you!

Go Back
Print
0562-2290098 0562-2296887
浏览手机站