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What is The Influence of Cob Technology on New Aluminum Substrate?

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  Aluminum substrate was first used in some special fields.In recent years,with the rapid development of LED lighting,aluminum substrate is exposed from the center of PCB family.LED lighting products are mainly composed of three structures:light source,power supply and substrate.As one of them,the substrate accounts for a large part of the cost of the whole lamp.The rapid development of LED lighting has brought infinite vitality to the aluminum substrate industry.The aluminum substrate industry has sprung up,as if springing up,overnight,everywhere.From the traditional large-scale PCB manufacturers,to the family workshops,as well as some ceramic substrates,are all competing for LED lighting this cake.

  At the same time,the competition in the market of LED auxiliary materials is no less intense than that in the downstream finished product use field.The price of aluminum substrate ranges from more than 100 yuan per square meter to more than 1000 yuan,with great differences and a mixture of advantages and disadvantages.If we want to find a way in the Red Sea,we need to know our own position and have the ability to develop core technologies.

  New technology and innovation

  The technical innovation of aluminum substrate is more around the development of packaging,aiming at some problems in the packaging process.Therefore,the new packaging methods are especially concerned by aluminum substrate enterprises,especially cob packaging.

  As soon as cob packaging comes out,it attracts attention from all aspects with many advantages,such as low thermal resistance,high light efficiency,no welding,low cost,etc.,and is praised as one of the top ten trends and hot spots of LED packaging technology in the future by experts in the industry.However,cob packaging is not as good as everyone's imagination,and it has not been quickly accepted by the market.Now it is only used in a small number of downlights,so what hinders its spread?

  The use of high-power LED has always been plagued by its thermoelectric problems.

  "In addition,the binding point of cob packaging will be vulcanized due to objective reasons,which will cause the chip to turn yellow after packaging,and finally affect the light failure,which is one of the cancers affecting cob in a wide range."Jian Yucang,general manager of Shenzhen Ruwei Electronics Co.,Ltd.,said that this was also caused by the purpose of conducting electricity after packaging integration,which is difficult to avoid with the existing packaging technology.

  In the LED lighting industry,heat conduction and heat dissipation is an important part of lighting planning,especially the heat dissipation of high-power LED,which has always been a bottleneck.If the problem of heat conduction and heat dissipation is not solved in the planning process,this product is likely to be a waste!Moreover,the problem of heat conduction is not solved,and the radiator is useless no matter how big it is.

  Most of the electric energy of LED is converted into heat energy,which makes the life span of the equipment decline sharply.Because of the high thermal conductivity and good heat dissipation of aluminum,it can effectively export the internal heat,so the current high-power LED and LED lamps basically weld the LED tube on the aluminum substrate,and then the aluminum substrate is bonded with the aluminum radiator through the thermal conductive adhesive.

  The heat generated by LED is transmitted to the metal substrate through the insulating layer,and then to the radiator through the thermal interface material,so that most of the heat generated by LED can be distributed to the surrounding air through convection.However,the thermal resistance of aluminum substrate and heat transfer adhesive is large,which affects the light efficiency and life of LED.

  Most of the ordinary aluminum substrate insulation layer has very small thermal conductivity or even no thermal conductivity,so the heat can not be transmitted from led to the heat sink(metal substrate),and the whole heat dissipation channel can not be dredged.The thermal build-up of LEDs can quickly lead to LED failure.

  It can also be said that in the existing process,both ceramic substrate and aluminum substrate can not be avoided,and new technology is urgently needed to overcome.Therefore,a PCB based thermoelectric separation technology is used on the aluminum substrate,so there is a special aluminum substrate for cob,which can not only deal with the heat dissipation problem of the package,but also overcome the vulcanization phenomenon of cob and improve the light efficiency.




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