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Ceramic substrate manufacturers to share the following types and substrates

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  Ceramic substrates are popular because of their high-quality insulation characteristics,high heat transfer characteristics,excellent solderability and high adhesion strength.The requirements for ceramic fiber boards in the sales market are also very large.The key use of output power electronic devices,electronic packaging,hybrid Microelectronics and multi-integrated IC control modules and other industries.As a manufacturer of ceramic circuit boards,Jin Ruixin shares today the types and plates of ceramic substrate pcb.

  Ceramic substrate PCB

  Type of ceramic substrate:

  At present,there are five types of ceramic heat pipe heat dissipation base steel plates:HTCC,LTCC,DBC,DPC,and LAM.Among them,LAM belongs to the patent of invention in collaboration between Slystone and the National Optoelectronic Laboratory of Huazhong University of Science and Technology.Fees are higher.

  The DBC and DPC are professional technicians who have developed and designed well in China in recent years,and have kinetic energy production.DBC uses high temperature heating to merge Al2O3 and Cu plates.Its technical shortcomings depend on the difficulty of handling Al2O3 and Cu plates.Difficulties caused by micro-pores have caused great challenges to the mass production kinetic energy and pass rate of the product.DPC technology uses immediate barrel plating technology to deposit Cu above Al2O3-based steel plates.Its processing technology incorporates raw materials With the production process of plastic film,its commodity is the most widely used ceramic heat pipe heat dissipation base steel plate in recent years.It is not known that its raw material manipulation and production process integration work capacity requirements are relatively high,which prompts the relatively high technical threshold for entering the DPC industry chain and capable of stable production.

  The raw materials of the ceramic substrate PCB are generally aluminum oxide and aluminum nitride.The aluminum oxide ceramic substrate believes that the coefficient of thermal expansion is high and is mainly used in the electronics industry;and the aluminum nitride raw material is used for heat dissipation in aerospace high heat transfer heat pipes Commodity application.

Ceramic substrate

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