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What are the advantages of ceramic substrate amb for active metal brazing technology?

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  There are many techniques for ceramic substrate processing.In addition to DPC,DBC,HTCC,LTCC,there is also AMB(Active Metal Bonding),which is the technology of brazing copper clad for specific metal materials.What I want to share today is the advantages of the amb processing technology that has attracted much attention at this stage.

  Amb specific metal material brazing process and advantages

  The further development trend of DBC technology is to complete the high-temperature metallurgical industry fusion of aluminum nitride and oxygen-free copper with the help of specific metal brazing materials,and the AMB substrate using AlN structure ceramics has a smaller heat transfer coefficient and a lower linear expansion coefficient And a more stable part of the charging and discharging work capacity;Compared with the traditional DBC-based steel plate,the aluminum nitride copper-clad ceramic substrate prepared by the AMB processing technology not only has a higher thermal conductivity,and the copper layer has high compressive strength.Highlight the advantages:smaller heat transfer coefficient,lower linear expansion coefficient and more stable.


ceramic substrate


  Application of Amb specific metal material brazing

  Due to China's ceramic substrate copper-clad technology,strict supervision of polyimide membranes cannot be completely achieved,such as the frequency of cold cycle systems.At this stage,excellent active metal bonding(AMB)technology is used to carry out copper coating,which has higher combined compressive strength and hot-cold circulation system characteristics than immediate copper coating(DBC).It is widely used in the IGBT industry,very large power electronic device modules on high-speed rail.
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