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Ceramic substrate: What processing technology research will there be on engineering ceramics?

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  Engineering ceramic materials are hard,brittle and difficult to machine materials.In the grinding process,the removal of the processed material is dependent on the rolling action or micro-cutting action of abrasive particles.Model of abrasive effect.Abrasive particles act on the surface with convex,concave and microcracks.As the grinding process progresses,part of the abrasive particles are pressed into the grinding disc due to the grinding pressure,and the exposed abrasive tip is used to scribe the surface of the workpiece for micro-cutting;The other part of the ceramic pin gauge abrasive particles rolls between the workpiece and the grinding disc to produce a rolling effect.

  Because the tensile strength of hard and brittle materials is lower than the compressive strength,under the action of abrasive particles,microcracks are generated in the parts where the tensile stress of the processed surface of the hard and brittle materials is the largest.When the criss-crossing cracks expand and cross each other,the part surrounded by the cracks will be brittle fracture and break out of small pieces to form chips,so as to achieve the purpose of surface removal.

  This is the basic process of chip generation and surface formation mechanism during the grinding of hard and brittle materials.It can be seen that the rolling action is produced by the free abrasive particles between the workpiece and the grinding disc,and the micro-cutting action is produced by the fixed abrasive grains embedded on the surface of the grinding disc.Therefore,the grinding process of hard and brittle materials is actually the result of the combined action of free abrasive particles and fixed abrasive particles.During the grinding process,the state of the abrasive particles depends on the material of the grinding disc and the processing load.


Ceramic substrate


  ceramic parts

  If the minimum radius of the crack area is defined as the length of the crack,and the length of the crack on the surface and inside is considered to be roughly equal,the greater the load,the longer the crack length in the horizontal direction.The micrograph of the crack on the silicon surface.

  When grinding hard and brittle materials,it is important to control the size and uniformity of cracks.On the one hand,the ceramic nozzle must ensure that no major damage occurs on the surface during processing;on the other hand,in order to improve the processing efficiency,it is necessary to promote small breakage.By selecting the size of the abrasive particles and controlling the uniformity of the size,it is possible to avoid particularly large ceramic roller processing defects.
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