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Ceramic substrate: What are the important processes?

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  Porcelain-based polyimide film is currently in high demand in the market,and the processing technology level is relatively mature.It has been widely used in the sales market.So what are the processing techniques for porcelain-based polyimide film?

  What is porcelain polyimide film

  Porcelain polyimide film is abbreviated as DBC-based steel plate in English.It is composed of porcelain plate,bonding layer and conductive layer.It means that copper is immediately bonded to aluminum oxide or aluminum nitride ceramic at high temperature.The unique processing method on the surface of the substrate has high heat transfer characteristics,high adhesive compressive strength,excellent soft fiber solderability and high-quality insulation characteristics,but it cannot pass through holes,is poor in precision,and the surface is not smooth.Because of the graphic boundaries,only regions with large intervals can be used,and high-precision regions cannot be used.Moreover,small-scale taxpayer manufacturing cannot be completed only with mass production.

ceramic resistors

  LAN ceramic substrate technology

  Nowadays,the production and manufacture of porcelain polyimide film in the field has long been LAM technology(laser rapid active metallization technology)to replace DBC technology.The porcelain circuit boards manufactured by this new type of technology have stronger thermal conductivity,stronger and lower The ceramic film layer is resistant to resistance,the linear expansion coefficient is more matched,and the base steel plate has good forgeability,high application temperature,low high-frequency loss,and high-density assembly.The copper layer has no air oxide layer and no organic components,dielectric The strength is very good.The thickness of the conductive layer can be customized according to customer requirements.Between 1μm-1mm,the most important thing is that it can be completed in 2D and 3D.

  Ceramic substrate DBC technology and characteristics

  DBC technology.Thick copper layer,fast production and processing,low price,can be made into double layers,suitable for mass production.

  But this kind of technology cannot pass through,the precision is poor,and the flatness(roughness)is low.It is suitable for installation on products with large intervals,and cannot be used in high-precision fields.Nowadays,everyone's living standards are getting higher and higher,and the quality regulations on products are getting higher and higher.Currently on the market,there are manufacturers of DBC processing technology in Zibo City,Shandong Province.

  Ceramic substrate DPC technology

  DPC technology is a technology that uses vacuum pump magnetron sputtering to carry out copper electroplating.This process is one step more than other processing techniques.Its advantages depend on high precision,good flatness,good combination(within the relative application category),and the ability to pass holes.
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