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Ceramic substrate: What are the technical advantages of active metal brazing?

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  There are many techniques for ceramic substrate processing.In addition to DPC processing,DBC processing,HTCC,LTCC,there is also AMB(Active Metal Bonding),which is the technicality of specific metal material welding copper clad.What I want to share today is the advantages of the amb processing technology that has attracted much attention at this stage.

  Amb specific metal material welding process and advantages

  The further development trend of DBC technology is to complete the high-temperature metallurgical industry fusion of aluminum nitride and T2 oxygen-free copper with the help of specific metal brazing materials.The AMB substrate of AlN structure ceramics has a smaller heat transfer coefficient and lower linear expansion.Coefficient and a more stable part of the charge and discharge capacity;compared with the traditional DBC-based steel plate,the aluminum nitride copper-clad ceramic substrate made by the AMB processing technology not only has higher thermal conductivity,and the copper layer fusion has high compressive strength..Highlight the advantages:smaller heat transfer coefficient,lower linear expansion coefficient and more stable.

ceramic substrate

  Application of Amb specific metal material welding

  Due to China's ceramic substrate copper-clad technology,strict supervision of polyimide membranes cannot be completely achieved,such as the frequency of cold cycle systems.At this stage,excellent active metal bonding(AMB)technology is used to carry out copper coating,which has higher combined compressive strength and hot-cold circulation system characteristics than immediate copper coating(DBC).It is widely used in the IGBT industry,which is very large power electronic device module on high-speed rail.
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