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How to analyze the development and current situation of ceramic substrates?

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  Ceramic substrate materials are widely used in power electronics,electronic packaging,hybrid microelectronics and multi-chip modules due to their excellent thermal conductivity and air tightness.

  Comparison of substrate types and their characteristics.

  There are currently four common ceramic heat sink substrates:HTCC,LTCC,DBC and DPC,among which HTCC is an earlier developed technology.However,due to the high sintering temperature,the selection of electrode materials is limited,and the manufacturing cost is relatively expensive,which promotes the development of LTCC.Although LTCC reduces the co-firing temperature to around 850°C,its disadvantage is that it is difficult to control the dimensional accuracy and product strength.

ceramic substrates

  However,DBC and DPC are specialized technologies that have been developed in China in recent years and can be mass-produced.DBC combines Al2O3 and copper plate through high temperature heating.The technical bottleneck is that it is difficult to solve the problem of micro-holes between Al2O3 and copper plate,which makes the mass production energy and yield of products greatly challenged.DPC technology uses direct copper plating technology to deposit copper on Al2O3 substrates.Its process combines materials and thin film technology.Its products are the most commonly used ceramic heat sink substrates in recent years,but the material control and process technology integration capabilities are high,making it enter the DPC industry and stable The technical threshold for production is relatively high.

  Direct copper plating

  DPC is also called direct copper plating substrate.Take the DPC substrate process as an example:firstly,the ceramic substrate is pretreated and cleaned,and the thin-film professional manufacturing technology-vacuum coating is used to sputter and bond the copper-metal composite layer on the ceramic substrate.Then,the circuit manufacturing is completed by the process of exposing,developing,etching and removing the yellow photoresist film again.Finally,increase the thickness of the circuit through electroplating/electroless deposition.After removing the photoresist,the metallization circuit is completed.
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