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What are the applications and introductions of ceramic substrates?

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  Ceramic substrate refers to a special process board in which copper foil is directly typed into the surface(single-sided or double-sided)of aluminum oxide(AI2O3)or aluminum nitride(AlN)ceramic substrate at high temperature.The made ultra-thin composite board has excellent electrical insulation properties,high thermal conductivity,excellent soft fiber weldability and high adhesion strength,can etch various patterns like a PCB board,and has a large current carrying capacity.Therefore,ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology.

  Features of ceramic substrate:

  Structure:Excellent mechanical strength,low warpage,thermal expansion coefficient close to silicon wafer(aluminum nitride),high hardness,good processability,and high dimensional accuracy.

  Climate:high temperature and high humidity environment,high thermal conductivity,good heat resistance,corrosion and abrasion resistance,UV and yellowing resistance.

  Chemistry:Lead-free,non-toxic,and chemically stable.

  Electricity:high insulation resistance,metallization,strong adhesion to circuit patterns.

  Market:Abundant materials(pottery clay,aluminum),simple manufacturing,and low price.

Ceramic substrate

  Ceramic circuit board process classification:

  Thin film method(DPC technology):Thin film method is the main method of metal thin film deposition in microelectronics manufacturing.It mainly uses area deposition techniques such as evaporation and magnetron sputtering to metalize the substrate surface.It is suitable for most ceramic substrates.However,this method requires the subsequent etching technique to complete the pattern transfer.

  Thick film method(DPC technology):The thick film method is to deposit conductive paste on the substrate through micro-flow direct writing technology such as screen printing technology,microwriting technology and inkjet printing technology,and form conductive lines and Electrodes,etc.,this method is suitable for most ceramic substrates.Thick film conductive paste is generally composed of micron-sized metal powder and a small amount of glass binder and organic solvent.The glass glue in the slurry is combined with the substrate at high temperature to make the thick film conductive glue stick to the surface of the substrate.If the amount of glue is too much,the excess glass will float on the surface of the wire,resulting in a decrease in solder wettability.

  direct copper coating method(DPC technology):direct copper coating method(DirectBondedCopper,DBC)technology is mainly based on the ceramic surface metallization technology developed by the Al2O3 ceramic substrate and applied to AlN ceramics.It has been successfully applied in the fields of high-power power semiconductor modules,solar panel components,automotive electronics,aerospace and military electronic components,and smart power components.*J.F.Burgess and Y.S.Sun also proposed this technology in 1975.The copper foil(thickness above 0.1mm)is protected by a special technical method of directly closing the Al2O3 ceramic base surface at a temperature of 1065℃~1083℃under the protection of N2 atmosphere.
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