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How to process and customize gold-tin alloy ceramic circuit boards?

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  In addition to high-quality plates,high-quality processing and manufacturing techniques are also very important for the processing and production of ceramic substrates.Now in the processing technology of ceramic substrates,in addition to gold,silver,tin,gold,silver,nickel and palladium plating,Also added gold-tin alloy ceramic substrate production technology and platinum technology to produce ceramic substrates.Today's editor will discuss the advantages of alloy ceramic circuit boards.

  1.The advantages and disadvantages of gold-tin alloy ceramic circuit boards.

  The advantages of gold-tin alloy ceramic circuit boards.

  1.The melting point of gold-tin alloy is lower,and the welding temperature is moderate and the welding process is greatly shortened.

  The gold-tin alloy ceramic circuit board uses gold-tin soldering materials,and the soldering temperature is 20~30℃higher than its melting point(that is,about 300~310).The gold-tin alloy is eutectic,which is fast in combination and solidifies.The assembly of components with high stability requirements generally adapts to gold-tin alloys.

  2.High temperature 250~260℃can meet the requirements of high strength air tightness.

  3.Good lubricity,good lubricity,and corrosion of lead-free tin solder on the gold-plated layer.Since the gold-tin alloy is close to the composition of the gold-plated layer,the degree of impregnation of the thin-plated layer by diffusion is low,and there is no silver transfer phenomenon.

  4,low viscosity-can fill a relatively large gap,stable and no fluidity.

  5.Good thermal conductivity,high solder corrosion resistance,high creep resistance,good thermal and electrical conductivity,and a thermal conductivity of 57W/mk.

  6.Lead-free,environmentally friendly.

ceramic substrates

  The shortcomings of gold-tin alloy ceramic circuit boards.

  1.The price is high,the performance is brittle,the elongation is small,and the processing is difficult.

  2.It has a high melting point and cannot be soldered with low melting point solder at the same time.

  3.It can only be applied to occasions where the chip temporarily exceeds 300°C.

  4.Too thick gold plating,too thin pads,and too long soldering time will increase the gold diffused into the solder and increase the melting point.

  Second,the application fields of gold-tin alloy ceramic circuit boards.

  1.Chip packaging high-power equipment.

  2,microelectronics,optoelectronics,intermediate IC and power semiconductor equipment.

  3.Laser diode.

  4,high-power LED chip packaging,high-power LED chip packaging and other applications.

  Improving the heat dissipation capacity of high-power LED diodes is the core issue of light-emitting diode device packaging and device application design.The chip bottom paste material usually chooses thermal conductive glue,conductive silver paste,tin paste and gold-tin alloy welding.The thermal conductivity of gold-tin alloy solder is the best among the four materials,and the electrical conductivity is also very good.

  5.Thin-film microwave ceramic dielectric substrates(alumina substrates,aluminum nitride substrates,etc.)are widely used in thin-film circuits.

  Using gold-plated tin alloy pads.
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