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Alumina ceramic substrate is an application of advanced ceramic materials

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  Advanced ceramic materials,also known as precision ceramic materials,refer to products with excellent performance made with refined high-purity,ultra-fine inorganic compounds as raw materials and advanced preparation techniques.According to the requirements of engineering technology for product performance,the manufactured products have piezoelectric,ferroelectric,conductive,semiconductor,magnetic and other high strength,high toughness,high hardness,wear resistance,corrosion resistance,high temperature,and high thermal conductivity.,Heat insulation and good biocompatibility and other excellent properties.

  Alumina(Al2O3)ceramics have good comprehensive properties,and their current applications are mature.Alumina(Al2O3)ceramics are rich in raw materials,low in price,high in strength,high in hardness,thermal shock resistance,good insulation properties,good chemical stability,and good adhesion to metals.Now,Al2O3 is the main material of ceramic substrates.According to the measurement of the Shanghai Institute of Ceramics,Chinese Academy of Sciences,the Rockwell hardness of alumina(Al2O3)ceramics is second only to HRA80-90,far exceeding the wear resistance of wear-resistant steel and stainless steel.According to the measurement of the Institute of Powder Metallurgy of Central South University,the wear resistance of alumina(Al2O3)ceramics is 266 times that of manganese steel and 171.5 times that of high-chromium cast iron.The density of alumina(Al2O3)ceramics is 3.5g/cm3,which is only half that of steel,which can greatly reduce equipment load.

  According to the"InsightPartners"forecast of the European alumina ceramic market-the impact and analysis of COVID-19-according to research on applications(electronics and semiconductors,energy and power,military and defense,automotive,industry,medical,etc.),it is expected to be 2027 In 2010,the alumina ceramic market will increase from US$9.1174 billion in 2019 to US$1.3020 million,and is expected to grow at a compound annual growth rate of 3.2%from 2020 to 2027.

  Ceramic substrates can just meet the performance requirements of mid-to-high-end chips.They are well used in mid-to-high-end products in the fields of home appliance lighting,information communications,sensors,etc.,and are ideal packaging materials for next-generation large-scale integrated circuits and power electronic modules.The use of ceramic substrates has provided impetus for the electronics and semiconductor industries.


Ceramic substrate


  Heating management,prolong the service life of CMOS image sensor.

  The way to collect the light signal of the CMOS image sensor is active,and the charge generated by the photodiode is directly amplified and output by the transistor.When dealing with rapidly changing images,the current will change frequently and the flow will increase,leading to overheating.Affect the service life and reliability of CMOS image sensors.Due to the small size of the CMOS image sensor,most of the heat cannot be dissipated from the surface and can only be started from the substrate.With its low thermal conductivity(20~27W/m.K),Stoneon alumina ceramic substrate can meet the high heat dissipation requirements of CMOS image sensors and further extend the service life of the product.

  Reliable performance,ensuring the use of automotive sensors.

  Because the sensor in the car has been in a unique harsh environment(high temperature,low temperature,vibration,acceleration,humidity,noise,exhaust gas)for a long time,it should have the characteristics of light weight,good reusability,and wide output range.Ceramics are resistant to high temperature,vibration,humidity,and chemical corrosion.Even in relatively harsh environments,ceramics can still protect chips from corrosion.Whether it is usability or reliability,ceramic substrates can bring great improvements to products.The ceramic substrate is the guarantee of the product's cost performance,which is beyond doubt.

  DPC technology gives products more possibilities.

  Silitong can provide customized services according to customer needs,and conduct proofing or mass production according to the product design drawings and requirements provided by users.The line/spacing(L/S)resolution can reach 20μm,the copper thickness can be freely selected between the copper thickness range of 1μm~1mm,and the small aperture is only 75um.And it supports PTH(Plated Through Hole)/Vias(Through Hole).Moreover,the ceramic substrate using the DPC process has better bonding force and better product quality.

  Ceramic substrate is more in line with the future development direction of high density,high precision and high reliability.This is a more feasible option.It is an important direction for the sustainable development of electronic packaging materials in the future.Faced with the chip packaging gap,Stone will adhere to a customary style,meet customer needs,cater to the market orientation,and provide better products and more considerate services.
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