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DPC ceramics: What are the characteristics of the ceramic substrate PCB board?

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  Ceramic substrate refers to a special process board in which copper foil is directly typed into the surface of aluminum oxide(Al2O3)or aluminum nitride(AlN)ceramic substrate(single-sided or double-sided)at high temperatures.The made ultra-thin composite board has excellent electrical insulation performance,high thermal conductivity,excellent weldability and high adhesion strength,can etch various patterns like a PCB board,and has a large current-carrying capacity.Therefore,ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology.

  The advent of ceramic substrate products has opened up a new development in the heat dissipation application industry.Due to the characteristics of ceramic substrate heat dissipation,coupled with the advantages of ceramic substrates such as high heat dissipation,low thermal resistance,long service life,and withstand voltage,with the development of production processes and equipment Improvements have accelerated the rationalization of product prices,which in turn expanded the application areas of the LED industry,such as indicator lights for home appliances,car lights,street lights,and large outdoor billboards.The successful development of ceramic substrates provides better services for indoor lighting and outdoor lighting products,and expands the future market areas of the LED industry.

  Features.

  ◆Strong mechanical stress,stable shape,high strength,high thermal conductivity,high insulation,strong bonding force,anti-corrosion.

  ◆Good thermal cycle performance,with up to 50,000 cycles,high reliability.

  ◆Like PCB board(or IMS substrate),it can etch the structure of various patterns without pollution and pollution.

  ◆Using temperature width-55℃~850℃,the thermal expansion coefficient is close to silicon,which simplifies the production technology of power modules.

  Introduction to common ceramic substrate PCB boards.


ceramic substrate


  |Divided by manufacturing technology.

  At this stage,the common types of ceramic heat dissipation substrates are HTCC,LTCC,DBC,DPC,and LAM.Among them,LAM is a patented technology in cooperation with the National Optoelectronic Laboratory of Huazhong University of Science and Technology,and HTCCLTCC is a sintering technology with high cost.

  DBC and DPC are domestically mature and energy-producing professional technologies in recent years.DBC uses high-temperature heating to combine Al2O3 and Cu plates.The technical bottleneck is difficult to solve the problem of micropores between Al2O3 and Cu plates.The mass production energy of this product The DPC technology uses direct copper plating technology to deposit Cu on the Al2O3 substrate.However,its material control and technology integration capabilities are very demanding.Entering the DPC industry,the technical threshold for stable production is relatively high.LAM technology is also called laser rapid activation metallization technology.

  1.HTCC(High-TemperatureCo-firedCeramic)

  HTCC is also known as high-temperature co-fired multilayer ceramics.The manufacturing process is very similar to LTCC.The main difference is that the ceramic powder of HTCC does not add glass material.Therefore,HTCC must be dried and hardened into embryos at a high temperature of 1300~1600℃.Via holes are filled and printed in the screen printing technology.The co-firing temperature is high,and the choice of metal conductor materials is limited.The main materials are tungsten,molybdenum,...and other metals with high melting point but poor conductivity.

  2.LTCC(Low-TemperatureCo-firedCeramic)

  LTCC is also known as low-temperature co-fired multilayer ceramic substrate.This technology first adds inorganic alumina powder and about 30%to 50%of the glass material into an organic binder,mixes them uniformly into a mud-like slurry,and then uses a scraper to scrape the slurry into Sheet-like,in the drying process,the sheet-like slurry is formed into thin embryos,and then drill holes are drilled according to the design of each layer

  3.DBC(DirectBondedCopper)

  The direct copper coating technology uses copper oxygen-containing eutectic liquid to directly coat copper on the ceramic.The basic principle is to introduce a proper amount of oxygen between the copper and the ceramic before or during the coating process,and the temperature is between 1065°C and 1083°C.Within the range,copper and oxygen form a Cu-O eutectic solution.The DBC technology uses the eutectic solution to chemically react with the ceramic substrate to generate CuAlO2 or CuAl2O4 phase,and at the same time infiltrate the copper foil to achieve the combination of the ceramic substrate and the copper plate.

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