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If you don’t understand ceramic substrates, look here, let’s tell you

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  Application of ceramic substrate

  1.high-power power semiconductor module;semiconductor cooler,electronic heater;power control circuit,power mixing circuit.

  2.Smart power components;communication power supplies;power electronic power devices.

  3.Automotive electronics,aerospace and military electronic components.

  Solar panel components;telecommunications dedicated switches,receiving systems and other industrial electronics.

  The characteristics of ceramic substrates

  1.Strong mechanical stress,stable shape;high strength,high thermal conductivity,high insulation;strong bonding force,corrosion resistance.

  2.Excellent thermal cycle performance,50,000 cycles,high reliability.

  3.Like PCB board(or IMS substrate),it can corrode the structure of various patterns;no pollution,no pollution.

  4.The temperature is wide-55 degree-850 degree;the thermal expansion coefficient is close to silicon,which simplifies the production process of power modules.

  The advantages of ceramic substrates.

  1.The thermal expansion coefficient of the ceramic substrate is close to that of the silicon chip,which can save the transition layer Mo chip,saving manpower,materials and costs;

  2.Reduce solder layer,reduce thermal resistance,reduce voids,and increase yield;

  3.Under the same current carrying capacity,the line width of 0.3mm thick copper foil is only 10%of that of ordinary printed circuit boards;

  4.The excellent thermal conductivity makes the chip package very compact,greatly improves the power density,and improves the reliability of the system and the device;

  5.Ultra-thin ceramic substrate(0.25mm)can replace BeO without environmental toxicity issues;

  6.??Large amount,100A current continuously passes through 1mm wide and 0.3mm thick copper body,the temperature rise is about 17 degree;100A current continuously passes through 2mm wide and 0.3mm thick copper body,the temperature rise is only about 5 degree;

ceramic substrates

  7.Low thermal resistance,10×10mm ceramic substrate thermal resistance 0.63mm thick ceramic substrate thermal resistance 0.31K/W,0.38mm thick ceramic substrate thermal resistance 0.19K/W,0.25mm thick ceramic substrate thermal resistance 0.14K/W.

  8.High insulation withstand voltage to ensure the personal safety and protection of the equipment.

  9.New packaging and assembly methods can be realized,so that the product is highly integrated and the volume is reduced.

  The performance requirements of ceramic substrates.

  One is mechanical properties.

  The mechanical strength is high enough to be used as a supporting element in addition to the mounted components;good workability,high dimensional accuracy;easy to achieve multilayer;smooth surface,no warpage,bending,micro-cracks,etc.

  The second is electrical properties.

  High insulation resistance and high insulation breakdown voltage;

  low dielectric constant;

  The dielectric loss is small;

  Under high temperature and high humidity conditions,the performance is stable and the reliability is guaranteed.

  The third is thermal properties.

  High thermal conductivity;

  The thermal expansion coefficient matches the related materials(especially the thermal expansion coefficient of Si);

  Excellent heat resistance.

  Four is other properties.

  Good chemical stability;easy to metallize,circuit pattern and strong adhesion;

  No moisture absorption;oil and chemical resistance;a-ray emission is small;

  The materials used are non-polluting and non-toxic;the crystal structure does not change within the operating temperature range;

  The raw materials are abundant;the technology is mature;the manufacturing is easy;the price is low.
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