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What is the difference between LED package PCB and DPC ceramic PCB?

Word:[Big][Middle][Small] QR Code 2021/9/6     Viewed:    
  The prosperous city is inseparable from the decoration of LED lights.I believe everyone has seen LEDs.Its figure appears in various places in our lives,illuminating our lives.

  power LED package printed circuit board as a carrier of heat and air convection,its thermal conductivity plays a decisive role in the heat dissipation of the LED.Due to its excellent performance and gradually reduced prices,DPC ceramic printed circuit boards have shown strong competitiveness in many electronic packaging materials and are the development trend of power-type light-emitting diode packaging in the future.With the development of science and technology and the emergence of new preparation technologies,high thermal conductivity ceramic materials,as a new type of electronic packaging printed circuit board material,have broad application prospects.

  LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology,but it has great particularity.Generally speaking,the die of the discrete device is sealed in the package,and the function of the package is mainly to protect the die and complete the electrical connection.Moreover,the LED packaging is to complete the output of electrical signals,protect the normal operation of the die,and output:visible light function,which has both electrical parameters and design and technical requirements for optical parameters.It is not possible to simply use discrete device packaging for LEDs.

  With the continuous improvement of the input power of the light-emitting diode chip,the large amount of heat generated by high-power heat dissipation puts forward higher requirements for the light-emitting diode packaging materials.In the light-emitting diode heat dissipation channel,the packaged printed circuit board is a key link to connect the internal and external heat dissipation channels,and has the functions of heat dissipation channel,circuit connection and chip physical support.For high-power light-emitting diode products,packaged printed circuit boards require high insulation,high thermal conductivity,and a thermal expansion coefficient matching the chip.


What is the difference between LED package PCB and DPC ceramic PCB?


  The existing solution is to directly fix the chip on the copper radiator,but the copper radiator itself is a conductive channel.As far as the light source is concerned,no thermoelectric separation is achieved.The light source is packaged on a printed circuit board,and an insulating layer is still needed to achieve thermoelectric separation.At this time,although the heat is not concentrated on the chip,it is concentrated near the insulating layer under the light source.Once the power increases,there will be heat problems.DPC ceramic substrate can solve this problem.It can directly fix the chip on the ceramic and form vertical interconnection holes on the ceramic to form an internal independent conductive channel.The ceramic itself is an insulator and can dissipate heat.This is thermoelectric separation at the light source level.

  SMDLED brackets that have appeared in recent years generally use high-temperature modified engineering plastic materials,using PPA(polyphthalamide)resin as raw materials,and adding modified fillers to improve the physical and chemical properties of PPA raw materials.Therefore,PPA material is more suitable for injection and use of SMDLED stents.The thermal conductivity of PPA plastic is very low,and its heat dissipation mainly uses a metal lead frame,which has limited heat dissipation capacity,and is only suitable for low-power LED packaging.

  In order to solve the problem of thermoelectric separation at the light source level,the ceramic substrate should have the following characteristics:first,it must have high thermal conductivity,which is several orders of magnitude higher than resin;second,it must have high insulation strength;third,the circuit The resolution is high,and the chip can be connected or flipped vertically without any problem.Fourth,the surface has high flatness,and there is no gap during welding.Fifth,ceramic and metal should have high adhesion;the sixth is a vertical connection hole,which can realize SMD packaging,thereby leading the circuit from the back to the front.The basis for satisfying these conditions is the DPC ceramic foundation.

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